Taiwan Tech teams up with JPC Connectivity to sign industry-academia collaboration agreement, fostering win-win innovation.
Taiwan Teach and JPC Connectivity have long been committed to promoting industry-academia collaboration to advance technological innovation. To strengthen the integration of academic research with industry applications, Taiwan Tech’s Industry-Academia Innovation College and JPC Connectivity officially signed an industry-academia cooperation agreement on May 7, joining hands to drive industrial upgrading and innovative development.

Taiwan Tech and JPC Connectivity join hands to officially sign an industry-academia cooperation agreement. Left: JPC Connectivity Chairperson Shu-Mei Zhang; Right: Taiwan Tech President Jia-Yush Yen.

At the signing ceremony, left: JPC Connectivity Chairperson Shu-Mei Zhang; right: Taiwan Tech President Jia-Yush Yen.
The signing ceremony was jointly hosted by Taiwan Tech President Jia-Yush Yen, Dean of the Industry-Academia Innovation College Huang-Jen Chiu, Chair Professor of the Department of Electronic and Computer Engineering San-Liang Lee, and JPC Connectivity Chairperson Shu-Mei Zhang. Both parties engaged in in-depth discussions about the cooperation details and future plans, demonstrating a strong shared commitment to advancing industry-academia collaboration. The cooperation agreement will be implemented in phases, with the initial phase spanning four years. JPC Connectivity will invest NT$3 million annually, totaling NT$12 million over four years, to support industry-academia research and development collaboration.
Taiwan Tech has long been dedicated to integrating technological research with practical applications and possesses a solid academic and research foundation. JPC Connectivity is a global leader in high-performance connectivity solutions, with products widely used in critical industries such as AI servers, high-performance computing (HPC), data centers, and cloud computing.

Taiwan Tech presented a commemorative gift to JPC Connectivity. Left: JPC Connectivity Chairperson Shu-Mei Zhang; Right: Taiwan Tech President Jia-Yush Yen.
This collaboration will strengthen the development of heterogeneous integration technology for semiconductor lasers and silicon photonic chips. It effectively combines Taiwan Tech’s research resources and expertise in silicon photonics with JPC Connectivity’s industry presence in optical communications. This partnership not only marks an important milestone in academia-industry cooperation toward technological innovation but also lays a solid foundation for nurturing the next generation of tech talent, injecting new momentum for the sustained growth of Taiwan’s technology industry.

Group photo of Taiwan Tech and JPC Connectivity after signing the industry-academia cooperation agreement.
